• Mainly used for SiC dies packaging process.

• Capable of high-quality pre-applied SiC dies to meet the requirements of the subsequent silver sintering process and achieve high-reliability SiC packaging.

Features:

Multi-purpose: Power device (IGBT, SiC) and optical module bonding

Support pre-bonding of dry or wet sinter paste process

Support pre-bonding of sinter film process

Bond force capability up to 300N (500N Optional) and process heat profiles up to 200 ℃

Support 0~360° rotatory bonding.

Supports bonding of multiple materials:

SIC, DTS, NTC, Clip, etc.

Support high-precision mode:+-5um@3 sigma

Support high-speed mode: 1.8K(+-12.5um）

Support secs-gem