Technical advantages: Mainly used to achieve void-free and perfect solder joints between high-power chip/device and its substrate. Process capability includes vacuum, inert or reducing atmosphere and our unique plasma enhanced technology to optimize soldering quality.

Product overview：

• Classic proven system design

• Powered by formic acid assistance technology

• PLC control system with Windows-based computer interface

Applications: Void free soldering for diode laser, optical communication device, high power chip packaging.

Features:

Rapid and precise temperature control

Formic acid process for low-T solder application

Automatic gas flow control with MFC

Custom direct-heated tooling fixture plate

Easy-to-use GUI

Options:

Vacuum pump

Additional gas lines

Various deoxidation modules

Custom heating plate

Extra monitor T/Cs

Water chiller