Technical advantages: Mainly used to achieve void-free and perfect solder joints between high power chip/device and its substrate.Process capability includes vacuum,inert or reducing atmosphere and ourunique plasma enhanced technology to optimize soldering quality.

Product overview：

• Industry-leading technology of microwave plasma enhanced soldering

• High performance vacuum reflow soldering due to highly efficient deoxidation

• PLC control system with Windows-based computer interface

Applications: Void free soldering for diode laser, optical communication device, high power chip packaging.

Features:

Void-free vacuum reflow soldering

Deaxidation assisted by MW plasma

Non-damage plasma technology

Perfect for low temperature solder process

Rapid and precise temperature control

Easy-to-use GUI

Options:

Vacuum pumg

Additional gas lines

Custom heating plate

Various deaxidation modules

Extra monitor T/Cs

Water chiller

Soft start and slow vent